Nanocomposite Inks Based on Nickel–Silver Core–Shell and Silver Nanoparticles for Fabrication Conductive Coatings at Low-Temperature Sintering

Nanocomposite inks composed of nickel–silver core–shell and silver nanoparticles (NPs) can combine the advantages lower cost, high conductivity, low-temperature sintering processes, which have attracted much attention in development materials for printed flexible electronics. In this context, present paper, we report process preparation nanocomposite ink containing nanoparticles, as main filler, doping material, their application fabrication conductive coatings. It was found that addition a low concentration Ag NPs to formulation based mainly on low-cost Ni-Ag improves properties coatings fabricated by deposition glass substrate. Two types prepared showed promising future application: (1) doped with 0.5% sintered at 200 °C cost larger industrial and, (2) 1% 150 patterns substrates. The conductivity such films similar, about 6 × 106 S/m, corresponds 35% bulk nickel.